ZF-TRW S-Cam 3
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Continental MFC430TA
Generic Sample for:SP17324 - Bosch - MPC2SP17323 - TRW S-Cam 3SP17329 - Continental - MFC400
Bosch – MPC2
This generic sample displays elements from three reports. Each report contains the complete and detailed analysis of one system only.A complementary comparison report will be sent everyone who buys reports on these three cameras in a bundle.
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Continental
Physical Analysis 8
o Views and Dimensions of the System
o System Opening
o Camera Module
o Image Sensor Board
Top Side – Global view
Top Side – High definition photo
Top Side – Main components identification
Bottom Side – High definition photo
o Electronic Board
Top Side – Global view
Top Side – High definition photo
Top Side – Main components markings
Top Side – Main components identification
Top Side – Other components markings
Top Side – Other components identification
Bottom Side – High definition photo
Bottom Side – Components identification
o CMOS Image Sensor
Package View and Dimensions
Package Disassembly
CIS – Die View
CIS – Cross-Section
Cost Analysis 46
o Accessing the BOM
o PCB Cost
o CIS Process Characteristics
o Cost Estimation of the ON Semiconductor CIS
o BOM Cost – Electronic Board
o BOM Cost – Image Sensor Board
o Housing Parts – Estimation
o BOM Cost - Housing
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Details of Electronic Board AV Cost
o Details of Image Sensor Board AV Cost
o Details of the System Assembly AV Cost
o Manufacturing Cost Breakdown
Estimated Price Analysis 77
o Estimation of the Manufacturing Price
Company services 80
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & selling price
Estimation of the production cost & selling price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Views and Dimensions
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
System Opening
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Camera Module
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
CIS Die View
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
CIS Cross-Section - Overview
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side – Main Components Markings
Overview / Introduction
Company Profile
Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor
Cost Analysis
Manufacturing Price
About System Plus
Electronic Board – Top Side – Main Components Identification
C O S TANALYSIS
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturing Price
About System Plus
PCB Cost – Electronic Board
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturing Price
About System Plus
BOM Cost – Electronic Board
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturing Price
About System Plus
Material Cost Breakdown by Component Categories
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturing Price
About System Plus
Assessing the Added-Value (AV) Cost
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost
Manufacturing Price
About System Plus
Manufacturing Cost Breakdown – 1M units
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Priceo Financial Ratioso Manufacturing Price
About System Plus
Estimation of the Manufacturing Price
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Pluso Company serviceso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT
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2015• Camera Module Industry Report
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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COMPANYSERVICES
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
Overview / Introduction
Company Profile
Physical Analysis
Cost Analysis
Manufacturing Price
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.