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© 2012 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGA20S125P Rev. C3 April 2013 F  G A 2  0  S 1 2  5 P 1 2  5  0 V  , 2  0 A   S h  o r  t   e  d  a  o  d  e I   G T Absolute Maximum Ratings  T C = 25°C unless otherwise noted Thermal Characteristics Notes: 1: Limited by Tjmax Symbol Description Ratings Unit V CES Collector to Emitter Voltage 1250 V V GES Gate to Emitter Voltage ±25 V I C Collector Current @ T C = 25 o C 40 A Collector Current @ T C = 100 o C 20 A I CM (1) Pulsed Collector Current 60 A I F Diode Continuous Forward Current @ T C = 25 o C 40 A I F Diode Continuous Forward Current @ T C = 100 o C 20 A P D Maximum Power Dissipation @ T C = 25 o C 250 W Maximum Power Dissipation @ T C = 100 o C 125 W T J Operating Junction T emperature -55 to +175 o C T stg Storage Temperature Range -55 to +175 o C T L Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds 300 o C Symbol Parameter T yp. Max. Unit R θJC (IGBT) Thermal Resistance, Junction to Case -- 0.6 o C  / W R θJA Thermal Resistance, Junction to Ambient -- 40 o C  / W G C E TO-3PN G C E FGA20S125P 1250 V, 20 A Shorted-anode IGBT Features Hi gh Speed Switching Low Sat uration Voltage : V CE(sat) = 2.0 V @ I C = 20 A Hi gh In put Imp edance RoHS Compl iant Applications Induction Hea ting, Micr owa ve oven General Description Using advanced field stop trench and shorted anode technol- ogy , Fairc hild ® ’s shorted-anode trench IGBTs offer superior con- duction and switching performances for soft switching applications. The device can operate in parallel configuration with exceptional avalanche capability. This device is designed for induction heating and microwave oven.

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© 2012 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

FGA20S125P Rev. C3

April 2013

F  GA2  0  S 1 2 

 5 P 1 2  5  0 V  ,2  0 A  S h  or  t   e d - an o d  eI   GBT 

Absolute Maximum Ratings TC = 25°C unless otherwise noted

Thermal Characteristics

Notes:1: Limited by Tjmax

Symbol Description Ratings UnitVCES Collector to Emitter Voltage 1250 V

VGES Gate to Emitter Voltage ±25 V

ICCollector Current @ TC = 25oC 40 A

Collector Current @ TC = 100oC 20 A

ICM (1) Pulsed Collector Current 60 A

IF Diode Continuous Forward Current @ TC = 25oC 40 A

IF Diode Continuous Forward Current @ TC = 100oC 20 A

PDMaximum Power Dissipation @ TC = 25oC 250 W

Maximum Power Dissipation @ TC = 100oC 125 W

TJ Operating Junction Temperature -55 to +175o

CTstg Storage Temperature Range -55 to +175 oC

TLMaximum Lead Temp. for soldering

Purposes, 1/8” from case for 5 seconds300 oC

Symbol Parameter Typ. Max. Unit

RθJC(IGBT) Thermal Resistance, Junction to Case -- 0.6 oC / W

RθJA Thermal Resistance, Junction to Ambient -- 40 oC / W

G C E

TO-3PN

G

C

E

FGA20S125P1250 V, 20 A Shorted-anode IGBT

Features

• High Speed Switching

• Low Saturation Voltage: VCE(sat) = 2.0 V @ IC = 20 A

• High Input Impedance

• RoHS Compliant

Applications

• Induction Heating, Microwave oven

General Description

Using advanced field stop trench and shorted anode technol-

ogy, Fairchild®’s shorted-anode trench IGBTs offer superior con-

duction and switching performances for soft switching

applications. The device can operate in parallel configuration

with exceptional avalanche capability. This device is designed

for induction heating and microwave oven.

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© 2012 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com

FGA20S125P Rev. C3

Package Marking and Ordering Information

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Device Marking Device Package Reel Size Tape Width Quantity

FGA20S125P FGA20S125P TO-3PN - - 30

Symbol Parameter Test Conditions Min. Typ. Max. Unit

Off Characteristics

ICES Collector Cut-Off Current VCE = 1250, VGE = 0V - - 1 mA

IGES G-E Leakage Current VGE = VGES, VCE = 0V - - ±500 nA

On Characteristics

VGE(th) G-E Threshold Voltage IC = 20mA, VCE = VGE 4.5 6.0 7.5 V

VCE(sat) Collector to Emitter Saturation Voltage

IC = 20A, VGE = 15V 

TC = 25oC- 2.0 2.5 V

IC = 20A, VGE = 15V,TC = 125oC

- 2.22 - V

IC = 20A, VGE = 15V,

TC = 175oC- 2.44

V

VFM Diode Forward VoltageIF = 20A, TC = 25oC - 1.75 2.4 V

IF = 20A, TC = 175oC - 2.22 - V

Dynamic Characteristics

Cies Input CapacitanceVCE = 30V, VGE = 0V,

f = 1MHz

- 1360 - pF

Coes Output Capacitance - 40 - pF

Cres Reverse Transfer Capacitance - 26 - pF

Switching Characcteristics

td(on) Turn-On Delay Time

VCC = 600V, IC = 20A,

RG = 10Ω, VGE = 15V,

Resistive Load, TC = 25oC 

- 10 - ns

tr  Rise Time - 260 - ns

td(off) Turn-Off Delay Time - 400 - ns

tf  Fall Time - 100 - ns

Eon Turn-On Switching Loss - 0.74 - mJ

Eoff  Turn-Off Switching Loss - 0.50 - mJ

Ets Total Switching Loss - 1.24 - mJ

td(on) Turn-On Delay Time

VCC = 600V, IC = 20A,RG = 10Ω, VGE = 15V,

Resistive Load, TC = 175oC 

- 11 - ns

tr  Rise Time - 320 - ns

td(off) Turn-Off Delay Time - 420 - ns

tf  Fall Time - 250 - ns

Eon Turn-On Switching Loss - 0.94 - mJ

Eoff  Turn-Off Switching Loss - 1.23 - mJ

Ets Total Switching Loss - 2.17 - mJ

Qg Total Gate Charge

VCE = 600V, IC = 20A,

VGE = 15V 

- 129 - nC

Qge Gate to Emitter Charge - 9 - nC

Qgc Gate to Collector Charge - 66 - nC

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© 2012 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com

FGA20S125P Rev. C3

Typical Performance Characteristics

Figure 1. Typical Output Characteristics Figure 2. Typical Saturation VoltageCharacteristics

Figure 3. Typical Saturation Voltage Figure 4. Transfer CharacteristicsCharacteritics

Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. Vge 

0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.00

20

40

60

80

100

120

140

160

8V

VGE = 17V

10V

9V

20VTC = 25

oC

 

15V

12V

   C  o   l   l  e  c   t  o  r   C  u  r  r  e  n   t ,   I   C   [   A   ]

Collector-Emitter Voltage, VCE [V]0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0

0

20

40

60

80

100

120

140

160

9V

8V

17V

TC = 175oC

 15V

12V

10V

VGE = 20V

   C  o   l   l  e  c   t  o  r   C  u  r  r  e  n   t ,   I   C   [   A   ]

Collector-Emitter Voltage, VCE [V]

0.0 1.0 2.0 3.0 4.0 5.00

20

40

60

80

100

120

Common Emitter 

VGE = 15V

TC = 25oC

TC = 175oC

   C  o   l   l  e  c   t  o

  r   C  u  r  r  e  n   t ,   I   C

   [   A   ]

Collector-Emitter Voltage, VCE [V]

0 1 2 3 4 5 6 7 8 9 10 11 12 13 140

20

40

60

80Common Emitter 

VCE = 20V

TC = 25oC

TC = 175oC

   C  o   l   l  e  c

   t  o  r   C  u  r  r  e  n   t ,   I   C   [   A   ]

Gate-Emitter Voltage,VGE [V]

25 50 75 100 125 150 1751.0

1.5

2.0

2.5

3.0

3.5

40A

20A

IC = 10A

Common Emitter 

VGE = 15V

   C  o   l   l  e  c   t  o  r  -   E  m   i   t   t  e  r   V  o   l   t  a  g  e ,   V

   C   E

   [   V   ]

Collector-EmitterCase Temperature, TC [oC]

4 8 12 16 200

5

10

15

20

IC = 10A 20A 40A

Common Emitter 

TC

= 25oC

 

   C  o   l   l  e  c   t  o  r  -   E  m   i   t   t  e  r   V  o   l   t  a  g  e ,   V   C   E

   [   V   ]

Gate-Emitter Voltage, VGE [V]

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© 2012 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com

FGA20S125P Rev. C3

Typical Performance Characteristics

Figure 7. Saturation Voltage vs. Vge Figure 8. Capacitance Characteristics

Figure 9. Gate Charge Characteristics Figure 10. SOA Characteristics

Figure 11. Turn-On Characteristics vs Figure 12. Turn-off Characteristics vs.Gate Resistance Gate Resistance

4 8 12 16 20

0

4

8

12

16

20

IC = 10A 20A 40A

Common Emitter 

TC = 175oC

   C  o   l   l  e  c   t  o  r  -   E  m   i   t   t  e  r   V  o   l   t  a  g  e ,

   V   C   E

   [   V   ]

Gate-Emitter Voltage, VGE [V]5 10 15 20 25 30

1

10

100

1000

10000

Common Emitter 

VGE = 0V, f = 1MHz

TC = 25oC

Cres

Coes

Cies

   C  a  p  a  c   i   t  a  n  c  e   [  p   F   ]

Collector-Emitter Voltage, VCE [V]

0 30 60 90 1200

3

6

9

12

15Common Emitter 

TC = 25oC

600V

400V

VCC

= 200V

 

   G  a   t  e  -   E

  m   i   t   t  e  r   V  o   l   t  a  g  e ,

   V   G   E

   [   V   ]

Gate Charge, Qg [nC]

1 10 100 10000.01

0.1

1

10

100

2000

1ms

10ms

DC

*Notes:

1. TC = 25oC

2. TJ = 175oC

3. Single Pulse

10μs

100μs

   C  o   l   l  e  c   t  o  r   C  u  r  r  e  n   t ,   I  c   [   A   ]

Collector-Emitter Voltage, VCE [V]

10 20 30 40 50 60 701

200

Common Emitter 

VCC= 600V, VGE= 15V

IC = 20A

TC = 25oC

TC = 175oC

td(on)

tr 

 

   S  w   i   t  c   h   i  n  g   T   i  m  e   [  n  s   ]

Gate Resistance, RG [Ω]

50 10 20 30 40 50 60 70

100

1000

10000Common Emitter 

VCC= 600V, VGE= 15V

IC = 20A

TC = 25o

C

TC = 175oC

td(off)

tf 

 

   S  w   i   t  c   h   i  n  g   T   i  m  e   [  n  s   ]

Gate Resistance, RG [Ω]

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© 2012 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com

FGA20S125P Rev. C3

Typical Performance Characteristics

Figure 13. Turn-on Characteristics VS. Figure 14.Turn-off Characteristics VS.Collector Current Collector Current

 

Figure 15. Switching Loss VS. Gate Resistance Figure 16. Switching Loss VS. Collector Current

Figure 17. Turn off Switching SOA Characteristics FIgure 18. Forward Characteristics

 

10 20 30 40

10

100

1000

Common Emitter 

VGE = 15V, RG = 10Ω

TC

= 25oC

TC

= 175oC t

td(on)

 

   S  w   i   t  c   h   i  n  g   T   i  m  e   [  n  s   ]

Collector Current, IC [A]

10 20 30 40

100

1000

Common Emitter 

VGE = 15V, RG = 10Ω

TC

= 25oC

TC

= 175oC

td(off)

tf 

 

   S  w   i   t  c   h   i  n  g   T   i  m  e   [  n  s   ]

Collector Current, IC [A]

10 20 30 40 50 60 70

1

10Common Emitter 

VCC

= 600V, VGE

= 15V

IC

= 20A

TC

= 25oC

TC

= 175oC

EonE

off 

 

   S  w   i   t  c   h   i  n  g

   L  o  s  s   [  m   J   ]

Gate Resistance, RG [Ω]

0.1 10 20 30 40100

1k

10k

Common Emitter 

VGE

= 15V, RG

= 10Ω

TC

= 25oC

TC

= 175oC

Eon

Eoff 

 

   S  w   i   t  c   h   i  n  g

   L  o  s  s   [  m   J   ]

Collector Current, IC [A]

30

1 20.1

1

10

80

TC = 25oC

TC = 175oC

Forward Voltage, VF [V]

   F  o  r  w  a  r   d   C  u  r  r  e  n   t ,   I   F   [   A   ]

0.51 10 100 1000

1

10

100

2000

Safe Operating Area

VGE

= 15V, TC

= 175oC

 

   C  o   l   l  e  c   t  o  r   C  u  r  r  e  n   t ,   I   C   [   A   ]

Collector-Emitter Voltage, VCE [V]

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© 2012 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com

FGA20S125P Rev. C3

Figure 19. Transient Thermal Impedance of IGBT

 

1E-5 1E-4 1E-3 0.01 0.1 1 101E-3

0.01

0.1

1

0.01

0.02

0.1

0.05

0.2

single pulse

 

   T   h  e  r  m  a   l   R  e  s  p  o  n  s  e   [   Z   t   h   j  c   ]

Rectangular Pulse Duration [sec]

 Duty Factor, D = t1/t2

 Peak T j = Pdm x Zthjc + TC

0.5

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© 2012 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com

FGA20S125P Rev. C3

Mechanical Dimensions

TO-3PN

Dimensions in Millimeters

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I   GBT 

© 2012 Fairchild Semiconductor Corporation 8 www.fairchildsemi.com

FGA20S125P Rev. C3

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY

PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY

THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THEEXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

 As used here in:

1. Life support devices or systems are devices or systems which, (a) areintended for surgical implant into the body or (b) support or sustain life,and (c) whose failure to perform when properly used in accordance withinstructions for use provided in the labeling, can be reasonablyexpected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to causethe failure of the life support device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONSDefinition of Terms

2Cool™ AccuPower™ AX-CAP®*BitSiC™Build it Now™CorePLUS™CorePOWER™CROSSVOLT ™CTL™Current Transfer Logic™DEUXPEED®

Dual Cool™EcoSPARK®

EfficentMax™ESBC™

Fairchild®

Fairchild Semiconductor ®FACT Quiet Series™FACT®

FAST®

FastvCore™FETBench™

FPS™F-PFS™FRFET®

Global Power ResourceSM

Green Bridge™Green FPS™Green FPS™ e-Series™Gmax ™GTO™IntelliMAX™ISOPLANAR™Marking Small Speakers Sound Louder and Better™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MicroPak2™

MillerDrive™MotionMax™mWSaver™OptoHiT™OPTOLOGIC®

OPTOPLANAR®

PowerTrench®

PowerXS™Programmable Active Droop™QFET®

QS™Quiet Series™RapidConfigure™

Saving our world, 1mW/W/kW at a time™SignalWise™SmartMax™SMART START™Solutions for Your Success™SPM®

STEALTH™

SuperFET®

SuperSOT™-3SuperSOT™-6SuperSOT™-8SupreMOS®

SyncFET™

Sync-Lock™

®*

TinyBoost™TinyBuck™TinyCalc™TinyLogic®

TINYOPTO™TinyPower™TinyPWM™TinyWire™TranSiC®

TriFault Detect™TRUECURRENT®*μSerDes™

UHC®

Ultra FRFET™UniFET™VCX™VisualMax™VoltagePlus™XS™

®

Datasheet Identification Product Status Definition

 Advance Information Formative / In DesignDatasheet contains the design specifications for product development. Specificationsmay change in any manner without notice.

Preliminary First ProductionDatasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time withoutnotice to improve design.

No Identification Needed Full ProductionDatasheet contains final specifications. Fairchild Semiconductor reserves the r ight tomake changes at any time without notice to improve the design.

Obsolete Not In ProductionDatasheet contains specifications on a product that is discontinued by FairchildSemiconductor. The datasheet is for reference information only.

ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,www.Fairchildsemi.com, under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failedapplication, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from theproliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized FairchildDistributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized FairchildDistributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of 

up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address andwarranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild iscommitted to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct o r from authorized distributors.

Rev. I64

®